PROBLEM TO BE SOLVED: To provide a heat radiator of a substrate, in which heat that an imaging element and components connected to the substrate generate is efficiently radiated.SOLUTION: When a first imaging element 110 emits heat, the heat is transmitted to a first heat radiation member 180 through pattern wiring 161 and vias 162. The first heat radiation member 180 transmits the heat from a rear end face 183 to a braided wire 143. The heat is radiated through the braised wire 143. The heat transmitted to the first heat radiation member 180 through a first substrate 150 and the pattern wiring 161 is liable to return again to the first substrate 150 and the first imaging element 110. Thus, air having thermal conductivity which is much lower than that of material of the first substrate 150 is arranged at a periphery of the first heat radiation member 180 as a heat insulator to prevent the heat transmitted to the first heat radiation member 180 from returning to the first imaging element 110.SELECTED DRAWING: Figure 2COPYRIGHT: (C)2017,JPO&INPIT【課題】基板に接続された撮像素子及び部品が生じた熱を効率よく放熱する基板の放熱装置を得る。【解決手段】第1の撮像素子110が熱を発すると、熱はパターン配線161及びビア162を介して第1の放熱部材180に伝達される。第1の放熱部材180は、後端面183から網組線143に熱を伝達する。網組線143を介して熱が発散される。第1の基板150及びパターン配線161を介して第1の放熱部材180に伝達された熱が、再び第1の基板150及び第1の撮像素子110に戻るおそれがある。そこで、第1の基板150の材料よりも遙かに低い熱伝導率を有する空気を第1の放熱部材180の周囲に断熱体として配置することにより、第1の放熱部材180に伝達された熱が第1の撮像素子110に戻ることを防ぐ。【選択図】図2
