金属化合物、該金属化合物の製造方法、及び該金属化合物での基材表面の選択的金属化

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专利权人:

ビーワイディー カンパニー リミテッドＢＹＤ ＣＯＭＰＡＮＹ ＬＩＭＩＴＥＤ

发明人:

ゴン・チン,チョウ・ウェイ,マオ・ビーフェン,ミャオ・ウェイフェン

申请号：

JP20160505698

公开号：

JP6116752(B2)

申请日:

2014.04.02

申请国别(地区):

日本

年份:

2017

代理人:

摘要：

The present disclosure provides a metal compound. The metal compound is represented by a formula (I): Cu2AαB2-αO4-&bgr; (I). A contains at least one element selected from the groups 6 and 8 of the periodic table. B contains at least one element selected from the group 13 of the periodic table, 0<α<2, and 0<&bgr;<1.5. Polymer article containing the metal compound and method for preparing the polymer article as well as selective metallization of a surface of the polymer article are also provided. In addition, the present disclosure provides an ink composition and the selective metallization for a surface of the insulative substrate using the ink composition.

来源网站：

中国工程科技知识中心

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http://www.ckcest.cn/home/