Lee Chun-Yu,Lo Sheng-Hung,Ho Wen-Lung,Tseng Wen-Sung
申请号：
US201514700533
公开号：
US10155252(B2)
申请日:
2015.04.30
申请国别(地区):
美国
年份:
2018
代理人:
McClure, Qualey & Rodack, LLP
摘要：
A semiconductor apparatus is provided. The semiconductor apparatus includes a wafer carrier, and a cup surrounding the wafer carrier. The semiconductor apparatus also includes a bottom washing device located between the wafer carrier and the cup, and configured to spray washing liquid onto the cup. Therefore, the cup can be washed by the bottom washing device.
