METHOD OF FORMING A MULTILAYER STRUCTURE

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专利权人:

Rohm and Haas Electronic Materials LLC

发明人:

Wang Deyan

申请号：

US201815912832

公开号：

US2018282165(A1)

申请日:

2018.03.06

申请国别(地区):

美国

年份:

2018

代理人:

摘要：

Compositions comprising a liquid carrier and certain MX/graphitic carbon precursors are useful in forming multilayer structures having an MX layer and a graphitic carbon layer disposed on a substrate, wherein the MX layer is interposed between the substrate and the graphitic carbon layer in the multilayer structure.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/