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模塊化填充設備和方法
专利权人:
DR. PY INSTITUTE LLC
发明人:
PY, DANIEL,丹尼爾.皮
申请号:
HK15109857.6
公开号:
HK1209088A
申请日:
2015.10.08
申请国别(地区):
HK
年份:
2016
代理人:
摘要:
The apparatus comprises a conveyor defining a path for transporting a device along the path; and a plurality of modules including at least one of (i) a de-contamination station located on the conveyor path and configured to receive therein the device and de-contaminate at least a surface of the device; (ii) a filling station located on the conveyor path downstream of the de-contamination station and including at least one filling or injection member that is in fluid communication with a source of substance to be filled into a chamber of the device; and (iii) a sealing station located on the conveyor path downstream of the filling station for sealing the filled device. The plurality of modules are (a) in series with each other, and/or (b) in parallel with each other, and are configured to permit addition of additional modules in series or in parallel with said plurality of modules.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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