An image pick-up module for an endoscope apparatus includes a base having a surface on which electronic elements including an image pick-up device, and an electronic cooling element are mounted. The surface of the base is provided with terminals for the electronic elements including the image pick-up device, terminals for the electronic cooling element, and terminals for wirings from an outside of the image pick-up module. The base further includes wirings electrically connecting with the terminals for the electronic elements including the image pick-up device, the terminals for the electronic cooling element, and the terminals for the outside wirings.
