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COMPOSITION POUR FORMER UN FILM
专利权人:
Shin-Etsu Chemical Co.; Ltd.
发明人:
申请号:
EP16204446.5
公开号:
EP3181126B1
申请日:
2016.12.15
申请国别(地区):
EP
年份:
2019
代理人:
摘要:
Provided is a composition for forming a film, the composition not having completely dissolved hydroxypropyl methyl cellulose (HPMC), and enabling formation of the film having a uniform thickness by suppressing the viscosity increase of the composition around an immersion temperature of 50°C. More specifically provided is a composition for forming a film, the composition comprising hypromellose having methoxy group content of 28.0 to 30.0% by weight and hydroxypropoxy group content of 7.6 to 8.5% by weight, wherein a 2% by weight aqueous solution of the hypromellose provides a viscosity at 20°C of 4.0 to 6.5 mPa·s, a 20% by weight dispersion of the hypromellose provides a viscosity at 50°C of 2,000 to 11,000 mPa·s, and a 20% by weight aqueous solution of the hypromellose provides a gelation temperature of 54 to 57°C; and a solvent.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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