Daniel Patrick Barrows,Zenghe Liu,Jeffrey George Linherdt,James Etzkorn
申请号：
US14139865
公开号：
US10039447B2
申请日:
2013.12.23
申请国别(地区):
US
年份:
2018
代理人:
摘要：
Molded electronic structures configured for use in body-mountable devices and methods for embedding molded electronic structures in a body-mountable device are described. An example method may include molding an electronic structure to have first curvature corresponding to a first radius of curvature. The electronic structure may include an antenna, a sensor, and an electronic device. The example method may also include adhering the molded electronic structure to a first polymer layer. The example method may additionally include forming a second polymer layer over the molded electronic structure adhered to the first polymer layer.
