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無菌接合装置
专利权人:
テルモ株式会社
发明人:
出水 俊,松井 克哉
申请号:
JP2012013396
公开号:
JP5851258B2
申请日:
2012.01.25
申请国别(地区):
JP
年份:
2016
代理人:
摘要:
PROBLEM TO BE SOLVED: To provide an aseptic joining device capable of certainly fusion-cutting and joining two tubes when fusion-cutting and joining the tubes.SOLUTION: This aseptic joining device includes: an interlock pin 60 as a fixing member fixing a closed clamp lid part 3 such that the clamp lid part 3 is not opened by abutting on the clamp lid part 3, and bringing the clamp lid part 3 into a state that the clamp lid part 3 can be opened by releasing the abutment on the clamp lid part 3 a wafer WF as a heating member for heating and fusion-cutting a first tube T1 and a second tube T2 a heater 110 heating the wafer WF a temperature sensor 87 measuring the temperature of environment wherein a casing is placed and a control part 100 changing a time for which a current is carried through the heater 110 based on the temperature of the environment measured by the temperature sensor 87, and changing a time for which the wafer WF heats the first tube T1 and the second tube T2.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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