Provided are an imaging unit, an imaging module, and an endoscope that are more compact and to which a plurality of electronic components can be easily and precisely mounted. An imaging unit 10 according to the present invention is characterized by comprising a semiconductor package 20； a circuit substrate 30 that has a main body section 31 on which a connection land is formed, and an attachment section 32 protruding from a back surface of the main body section 31 and having cable connection electrodes formed on at least two facing side surfaces among protruding side surfaces； electronic components 51, 52； and a plurality of cables 60a-60c, wherein, in the attachment section 32, a center plane a1 between the two side surfaces on which the cable connection electrodes are formed in a facing manner is shifted away from a center plane a2 and protrudes from the main body section 31, said center plane a2 being between side surfaces of the semiconductor package 20 that are parallel to the two side surfaces of the attachment section 32, and at least one side surface is perpendicular to the back surface of the main body section 31 and makes a stepped shape, and an electronic component mounting region R is located next to the attachment section 32 on the back surface of the main body section 31.L'invention concerne une unité d'imagerie, un module d'imagerie, et un endoscope qui sont plus compacts et auxquels une pluralité de composants électroniques peut être assemblée simplement et avec précision. Une unité d'imagerie 10 selon la présente invention est caractérisée en ce qu'elle comprend un boîtier semi-conducteur 20 ； un substrat de circuit 30 comprenant une section de corps principal 31 sur laquelle est formée une plage de connexion, et une section de fixation 32 faisant saillie depuis une surface arrière de la section de corps principal 31 et ayant des électrodes de connexion de câble formées sur au moins deux surfaces latérales opposées parmi des surfaces latérales saill
