An endoscope apparatus includes a polygonal camera module integrally formed at a wafer level by aligning and bonding a light collecting surface side of a lens wafer formed by laminating a plurality of optical wafers on which a plurality of optical parts are formed, and a device surface side of a sensor wafer on which a plurality of solid-state image pickup devices are formed, and then separating the aligned and bonded lens wafer and sensor wafer into individual pieces, wherein an endoscope functional portion is located in a region from an edge end portion of the camera module to an outer peripheral end of an outer shape portion.
