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Método para cortar productos de plástico a temperaturas variantes
专利权人:
B. Braun Melsungen AG
发明人:
Kieburg, Heinz,Franzke, Reiner
申请号:
ES13151657
公开号:
ES2585410T3
申请日:
2011.03.09
申请国别(地区):
ES
年份:
2016
代理人:
摘要:
Process for cutting plastic products for use in the medical sector provided on a web comprising the following steps: a) Providing products interconnected plastic embedded in a plastic web, b) determining positional data for products of interconnected plastic embedded in the plastic web through an optical acquisition and calculating a cutting pattern through a processing unit data, c) controlling the laser by means of a control system laser consisting of an optical controllable focus means controllable deviation and means beamformers, where depending on the determined positional data the position and intensity of the focal point of the at least one laser, d) cutting the products interconnected plastic supplied is controlled in a plastic web according to the cutting pattern calculated and one of the following s steps e) - e "), e) Making a quality test by means of a quality control with integrated pressure sensor, which measures the force required to push out the products cut plastic or product packages cut plastic or e ) perform a quality test by a control device with an integrated quality pressure sensor, which measures the negative pressure required to separate plastic products cut or severed packages of plastic or e ) perform a quality test by a control device with an integrated quality pressure sensor, which measures the tensile force required to separate the products cut plastic or plastic packages of cut.Proceso para cortar productos de plástico para uso en el sector médico proporcionados en una banda continua que comprende las siguientes etapas: a) Proporcionar productos de plástico interconectados incrustados en una banda continua de plástico, b) Determinar datos posicionales para productos de plástico interconectados incrustados en la banda continua de plástico a través de una unidad de adquisición óptica y cálculo de un patrón de corte a través de una unidad de procesamiento de datos, c) Controlar el láser por medio de un sistema de control de láser, que co
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