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光半導体装置用白色硬化性組成物
专利权人:
積水化学工業株式会社
发明人:
鹿毛 崇至,樋口 勲夫,中村 秀,谷川 満,渡邉 貴志
申请号:
JP20160015403
公开号:
JP6259846(B2)
申请日:
2016.01.29
申请国别(地区):
日本
年份:
2018
代理人:
摘要:
PROBLEM TO BE SOLVED: To provide an optical semiconductor device which includes a compact obtained by molding of a white curable composition for the optical semiconductor device and produces less migration at a metal part.SOLUTION: An optical semiconductor device 1 according to an embodiment of this invention comprises: a lead frame 2; an optical semiconductor element 3 mounted on the lead frame 2; and a compact 4 arranged on the lead frame 2. The compact 4 is obtained by hardening of a white curable composition for an optical semiconductor. The white curable composition for the optical semiconductor contains an epoxy compound, a curative agent, a titanium oxide, a filler different from the titanium oxide, a hardening accelerator and an antioxidant. A molecular mass of the antioxidant is 600 or larger and less than 2000. Constituent atoms of the antioxidant are only three kinds, a carbon atom, an oxygen atom and a hydrogen atom.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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