One embodiment is an implantable control module for coupling to one or more implantable stimulation leads. The control module includes a sealed housing, an electronic subassembly disposed in the housing, a header arrangement coupled to the housing, and a number of feedthrough elements. The header arrangement includes at least one receiving lumen and a number of contacts disposed within the at least one lumen. Each receiving lumen has two opposing openings which can receive an implantable stimulation lead through the opening and within the receiving lumen. The contacts are arranged within the at least one receiving lumen to make contact with (or otherwise be in electrical communication with) terminals at or on the stimulation lead received in the receiving lumen. The feedthrough elements extend from the header arrangement into the sealed housing, and electrically couple the contacts of the header arrangement with the electronic subassembly.
