An image pickup apparatus includes an image pickup device on which a light receiving section is formed, a heat transfer member made of a material having thermal conductivity equal to or higher than 15 W/(m·K), the heat transfer member including a wiring board, a joining section joined to the image pickup device, a bending section extended from the joining section, and a fixed section extended from the bending section, and a housing made of metal, an inner surface of which is in contact with a part of the fixed section of the heat transfer member housed on an inside.
