Provided is a photosensitive resin composition having superior chemical resistance while maintaining high sensitivity. The photosensitive resin composition contains: a polymer having (a1) a constituent unit having a group such that an acid group is protected by an acid-labile group and (a2) a constituent unit having a cross-linkable group, or (2) (a1) a polymer having a constituent unit having a group such that an acid group is protected by an acid-labile group and (a2) a polymer having a constituent unit having a cross-linkable group; (B) a photoacid generator; (C) an aromatic heterocyclic compound having a molecular weight of no greater than 1000, containing at least one nitrogen atom in the aromatic ring, and containing at least two coordinating atoms in the aromatic ring; and (D) a solvent.
