Provided is a photosensitive resin composition which has achieved good chemical resistance and more decreased relative dielectric constant, while maintaining high sensitivity. This photosensitive resin composition contains: (A) a polymer component which contains a polymer satisfying (1) and/or (2) described below; (B) a photoacid generator; and (C) a solvent. (1) a polymer that has (a1) a constituent unit having a group wherein an acid group is protected by an acid-decomposable group and (a2) a constituent unit having a crosslinkable group (2) a polymer that has the constituent unit (a1) and a polymer that has the constituent unit (a2) In this connection, the polymer component (A) contains at least one constituent unit (a4) having a lactone structure, or alternatively, (3) the photosensitive resin composition contains at least one polymer that contains the constituent unit (a4) but does not contain the constituent unit (a1) and the constituent unit (a2).
