Hypothermia Devices; Inc.;Hypothermia Devices, Inc.;The Regents of the University of California
发明人:
Vergara, Julio L.,Estrada, Daniel,Kalra, Mayank,Padula, Andrew,Cohn, Ryan
申请号：
AU2017241923
公开号：
AU2017241923A1
申请日:
2017.03.28
申请国别(地区):
AU
年份:
2018
代理人:
摘要：
A heat exchange module alone or part of a system including a control console. The HEM can include a channel enclosure assembly, a thermoelectric cooler (TEC) assembly and a heat transfer (cover) assembly. The enclosure assembly includes a channel for a heat-transfer liquid. The module can be constructed to provide for flexibility to better conform and fit on rounded and/or angular body parts and to efficiently transfer heat between the adjacent body part and the heat-transfer liquid via the TECs of the TEC assembly.
