Provided is an antimicrobial raw material having excellent antibacterial and corrosion-resistance properties, which can be directly formed as a film even on a plastic substrate with low heat-resistance or a substrate whereof the color or properties are likely to change due to heat, and this can be achieved at relatively low cost. The antimicrobial raw material is a laminated structure which comprises a substrate layer and a copper-tin alloy layer disposed on the substrate layer, and which has a thickness ranging from 5 nm to 200 nm. The substrate layer is made of resin, natural fiber, or paper, the resin having the deflection temperature under load being 115 °C or lower when measured in accordance with ASTM-D648-56 under a load of 1820 kPa. The copper-tin alloy layer contains over 60 at% but no more than 90 at% of copper and 10 at% or more but less than 40 at% of tin.
