您的位置: 首页 > 农业专利 > 详情页

Antimicrobial materials
专利权人:
三井化学株式会社
发明人:
廣田 幸治
申请号:
JP2014137814
公开号:
JP6374717B2
申请日:
2014.07.03
申请国别(地区):
JP
年份:
2018
代理人:
摘要:
PROBLEM TO BE SOLVED: To provide an antimicrobial material excellent in antibacterial properties and wear resistance.SOLUTION: According to the present invention, the antimicrobial material including a resin substrate layer and a copper-tin alloy thin film is provided. The copper-tin alloy thin film is disposed on the resin substrate layer and contains copper and tin in an atomic ratio of 50:50-95:5. A surface on the copper-tin alloy thin film side of the resin substrate layer has been subjected to roughening treatment. The thickness of the copper-tin alloy thin film is 2-1,500 nm.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

意 见 箱

匿名:登录

个人用户登录

找回密码

第三方账号登录

忘记密码

个人用户注册

必须为有效邮箱
6~16位数字与字母组合
6~16位数字与字母组合
请输入正确的手机号码

信息补充