Implantable nerve transducers are provided herein, along with methods of fabricated such implantable nerve transducers. An exemplary implantable nerve transducer includes a plurality of semiconductor structures protruding from an exterior surface provided by a substrate and a plurality of conductors extending from the exterior surface of the substrate to an interior surface of the substrate and within a plurality of openings in the substrate. Each conductor is electrically coupled to one of the semiconductor structures. The exemplary implantable nerve transducer further includes one or more electronic components electrically coupled to the semiconductor structures by the conductors and a cap bonded to the substrate to provide a sealed chamber. The sealed chamber contains the one or more electronic components.
