An implantable active medical device is disclosed and includes a hermetically sealed housing defining a sealed housing interior, the hermetically sealed housing having a first surface and an opposing second surface. A power source and electronics are in electrical communication and disposed within the sealed housing interior. A lead connector projects through the sealed housing interior from the first surface to the second surface. The lead connector has a first open end, a second open end, an outer surface, and an inner surface defining a lead aperture. The lead connector includes one or more electrically conducting contact rings spaced apart by electrically insulating rings. The one or more electrically conducting contact rings are in electrical communication with the electronics. The lead connector provides a hermetic seal between the lead connector outer surface and the lead connector inner surface.
