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Heat Dissipation Assemblies
专利权人:
发明人:
Kevin T. Lewis,Jason M. Woods,Dennis W. Dimick
申请号:
US14253162
公开号:
US20150289850A1
申请日:
2014.04.15
申请国别(地区):
US
年份:
2015
代理人:
摘要:
A coupling for interfacing a heat source to a heat sink for dissipating heat from the heat source includes a first portion and a second portion. The first portion defines a surface that defines a plurality of spaced apart voids that extend into the first portion. The second portion has an outside surface that complements the surface of the first portion. The second portion is capable of repeated mate and de-mate cycles from the first portion. A gel is disposed on the interior surface of the cavity. In operation, insertion of the second portion within the cavity causes a portion of the gel to displace into openings at first ends of the voids. The gel returns to an original shape when the second portion is removed from the cavity.
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