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A method for producing an aperture plate
专利权人:
发明人:
申请号:
EP14169722.7
公开号:
EP2947181A1
申请日:
2014.05.23
申请国别(地区):
EP
年份:
2015
代理人:
摘要:
An aperture plate is manufactured by plating metal around a mask of resist columns (2) having a desired size, pitch, and profile, which yields a wafer about 60µm thickness. This is approximately the full desired target aperture plate thickness. The plating is continued so that the metal (3) overlies the top surfaces of the columns until the desired apertures (4) are achieved. This needs only one masking/plating cycle to achieve the desired plate thickness. Also, the plate has passageways (24) formed beneath the apertures (32), formed as an integral part of the method, by mask material removal. These are suitable for entrainment of aerosolized droplets exiting the apertures (32).
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