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Hydrogenated block copolymer, resin composition, pressure-sensitive adhesive, adhesive, molded object, liquid-packaging container, medical tool, medical tube, corner member for weather seal, and weather seal
专利权人:
发明人:
OSHITA, SHINYA,大下晋弥,大下晉彌,NOJIMA, YUSUKE,野岛裕介,野島裕介,MASUDA, MIKIO,增田未起男,增田未起男
申请号:
TW105105372
公开号:
TW201638131A
申请日:
2016.02.24
申请国别(地区):
TW
年份:
2016
代理人:
摘要:
Provided are: a hydrogenated block copolymer which gives a resin composition that has satisfactory moldability and sufficient mechanical strength, is excellent in terms of flexibility, kink resistance, and transparency, and is excellent also in terms of tackiness, adhesiveness, or weatherability a resin composition containing the hydrogenated block copolymer and a pressure-sensitive adhesive, an adhesive, a molded object, a liquid-packaging container, a medical tool, a medical tube, a corner member for weather seals, and a weather seal which each comprise or include either the hydrogenated block copolymer or the resin composition. Specifically, the hydrogenated block copolymer is obtained by hydrogenating a block copolymer which comprises a polymer block (A) consisting mainly of structural units derived from an aromatic vinyl compound and a polymer block (B) consisting mainly of structural units derived from isoprene, structural units derived from butadiene, or structural units derived from a mixture of isoprene and butadiene. The content of the polymer block (A) is 1 mass% or higher but less than 5 mass% relative to the whole hydrogenated block copolymer, and the polymer block (B) has a total content of 1,2-bonds and 3,4-bonds of 30-85 mol%. The polymer block (B) has a degree of hydrogenation of 80 mol% or greater, and the hydrogenated block copolymer has a weight-average molecular weight of 150,000-800,000.提供可得到成形性良好且機械強度充分,柔軟性、耐扭折性及透明性皆優異,而且黏著性、接著性或耐候性優異的樹脂組成物的氫化嵌段共聚物、及含有該氫化嵌段共聚物的樹脂組成物、以及使用它們所得到的黏著劑、接著劑、成形體、液體包裝容器、醫療用具、醫療用管、耐候密封用角隅構件及耐候密封劑。具體而言,該氫化嵌段共聚物,係至少由以來自芳香族乙烯基化合物的結構單元作為主體之聚合物嵌段(A)、與以來自異戊二烯的結構單元、來自丁二烯的結構單元、或來自異戊二烯與丁二烯之混合物的結構單元作為主體之聚合物嵌段(B)所構成之嵌段共聚物經氫化之氫化嵌段共聚物,其中相對於該氫化嵌段共聚物之總量,聚合物嵌段(A)之含量為1質量%以上小於5質量%,聚合物嵌段(B)的1,2-鍵結及3,4-鍵結之合計含量為30~85莫耳%,聚合物嵌段(B)之氫化率為80莫耳%以上,該氫化嵌段共聚物之重量平均分子量為150,000~800,000。
来源网站:
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