A water bonding fixture is provided herein which includes a shaft and a plurality of electrically conductive plates disposed at one end of the shaft and spaced apart from each other so as to provide a gap between adjacent plates. Each electrically conductive plate defines two planar surfaces each of which are substantially exposed and each electrically conductive plate is electrically connected to each other electrically conductive plate to provide a surface area of conductive surface approximately equal to the exposed surface area of all of the electrically conductive plates. The water bonding fixture is preferably used in conjunction with swimming pool equipment such as pool pumps, skimmers and filters.
