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Header over-molded on a feedthrough assembly for an implantable device
专利权人:
GREATBATCH LTD.
发明人:
BIGGS, JAMES C
申请号:
EP09151287
公开号:
EP2082780A3
申请日:
2009.01.23
申请国别(地区):
EP
年份:
2012
代理人:
摘要:
A header assembly for connecting a conductor terminating at a body organ with an implantable medical device is described. The header assembly comprises a base plate, a feedthrough subassembly disposed in the base plate and comprising a ceramic-to-metal seal with first and second feedthrough wires passing through the ceramic-to-metal seal a first electrically conductive terminal connected to a distal end of the first feedthrough wire and having a first lead opening sized to receive a first portion of a lead for the conductor a second electrically conductive terminal connected to a distal end of the second feedthrough wire and having a second lead opening sized to receive a second portion of the lead for the conductor a body of polymeric material molded in a two-part construction to encase the conductive terminals and their feedthrough wires except for a first bore communicating from outside the polymeric body to the first and second lead openings aligned in a first co-axial relationship. Preferably, the polymeric body comprises a first polymeric material such as Techothane® or Polysulfone® encasing the terminals except the bore and an epoxy as a second polymeric material molded over the first polymeric material.
来源网站:
中国工程科技知识中心
来源网址:
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