Module with integrated power electronic circuitry and logic circuitry

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专利权人:

Infineon Technologies AG

发明人:

Chen Liu,Dinkel Markus,Salminen Toni

申请号：

US201414457663

公开号：

US9681558(B2)

申请日:

2014.08.12

申请国别(地区):

美国

年份:

2017

代理人:

Murphy, Bilak & Homiller, PLLC

摘要：

A integrated power module with integrated power electronic circuitry and logic circuitry includes an embedded power semiconductor module including one or more power semiconductor dies embedded in a dielectric material, a multi-layer logic printed circuit board with one or more logic dies mounted to a surface of the logic printed circuit board, and a flexible connection integrally formed between the embedded power semiconductor module and the logic printed circuit board. The flexible connection mechanically connects the embedded power semiconductor module to the logic printed circuit board and provides an electrical pathway between the embedded power semiconductor module and the logic printed circuit board. A method of manufacturing the integrated power module is also provided.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/