Disclosed herein is an ultra thin metalized edible film； wherein thickness of the metal coating lies in the range of about 0.01 micron to about 0.08 micron and that of edible film ranges from about 0.4 micron to about 6 microns. The invention also relates to a process for making the same comprising deposition of precious ultra thin metal film on an edible film that will not only support metalized film but will also prevent cracking of the ultra thin metal film and could be used for packing of the edibles thereby prolonging shelf life by protecting the food products from bacterial and germs attack and also enhancing aesthetics of the food products.
