Robert A. Stevenson,Xiaohong Tang,William C. Thiebolt,Christine A. Frysz,Keith W. Seitz,Richard L. Brendel,Thomas Marzano,Jason Woods,Dominick J. Frustaci,Steven W. Winn
申请号：
US15894239
公开号：
US20180178017A1
申请日:
2018.02.12
申请国别(地区):
US
年份:
2018
代理人:
摘要：
A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.
