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Elevated hermetic feedthrough insulator adapted for side attachment of electrical conductors on the body fluid side of an active implantable medical device
专利权人:
Greatbatch Ltd.
发明人:
Thomas Marzano,Keith W. Seitz,Robert A. Stevenson,Xiaohong Tang,William C. Thiebolt,Christine A. Frysz,Richard L. Brendel,Jason Woods,Steven W. Winn,Dominick J. Frustaci,Bruehl E. Truex,Donald H. Hick
申请号:
US14600401
公开号:
US09511220B2
申请日:
2015.01.20
申请国别(地区):
US
年份:
2016
代理人:
摘要:
An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.
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