Cui Li,LaBeaume Paul J.,Cutler Charlotte A.,Coley Suzanne M.,Yamada Shintaro,Cameron James F.,Williams William
申请号：
US201715834157
公开号：
US2018164686(A1)
申请日:
2017.12.07
申请国别(地区):
美国
年份:
2018
代理人:
摘要：
Methods of manufacturing electronic devices employing wet-strippable underlayer compositions comprising a condensate and/or hydrolyzate of a polymer comprising as polymerized units one or more first unsaturated monomers having a condensable silicon-containing moiety, wherein the condensable silicon-containing moiety is pendent to the polymer backbone, and one or more condensable silicon monomers are provided.
