An endoscope (1) includes: an imaging device chip (11) having a chip connection portion； a tubular housing tube (2) used to a scope tip portion (3) of an endoscope (1)； a substrate (12) to which the imaging device chip (11) is fixed, the substrate (12) having a substrate connection portion, the substrate (12) being capable of bending at near the substrate connection portion when the substrate (12) is inserted into the housing tube (2)； a lead wire connecting the substrate connection portion and the chip connection portion； flexible and non-conductive resin (23) covering an entirety of the lead wire； and an imaging module (10) including the substrate (12) provided with the imaging device chip (11) thereon, the imaging module (10) inserted into the housing tube (2).
