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METHOD OF PACKAGING IMAGING DEVICE CHIP, METHOD OF ASSEMBLING ENDOSCOPE, IMAGING MODULE, AND ENDOSCOPE
专利权人:
FUJIKURA LTD.
发明人:
Wei-Zhi HU,Kenichi NAKATATE,Takeshi SEGI,Kenichi ISHIBASHI,Fumihiko NISHIMURA,Satoshi HIDA,Hitoe IIKURA,Hideo SHIRATANI
申请号:
US14275214
公开号:
US20140249368A1
申请日:
2014.05.12
申请国别(地区):
US
年份:
2014
代理人:
摘要:
An endoscope includes: an imaging device chip having a chip connection portion; a tubular housing tube used to a scope tip portion of an endoscope; a substrate to which the imaging device chip is fixed, the substrate having a substrate connection portion, the substrate being capable of bending at near the substrate connection portion when the substrate is inserted into the housing tube; a lead wire connecting the substrate connection portion and the chip connection portion; flexible and non-conductive resin covering an entirety of the lead wire; and an imaging module including the substrate provided with the imaging device chip thereon, the imaging module inserted into the housing tube.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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