An imaging module includes: a chip size package having an image sensor that has a light receiving unit on a front side of the image sensor, the chip size package having connection lands on a back side of the image sensor； a circuit board having connection electrodes being electrically and mechanically connected to the connection lands of the chip size package through bumps； and an underfill material filled into a gap between the chip size package and the circuit board. The circuit board and the underfill material are provided within a projection plane on which the chip size package is projected in an optical axis direction of the image sensor. The circuit board has a cutout portion on a side surface thereof orthogonal to a connection surface of the circuit board with the chip size package such that the cutout portion is open to at least the connection surface.
