Chung Woh Lai,Xiao Hu Liu,Anita Madan,Klaus W. Schwarz,J. Campbell Scott
申请号：
US14174869
公开号：
US08865572B2
申请日:
2014.02.07
申请国别(地区):
US
年份:
2014
代理人:
摘要：
A system for manipulating dislocations on semiconductor devices, includes a moveable laser configured to generate a laser beam locally on a surface portion of the semiconductor body having a plurality of dislocations, the moveable laser being characterized as having a scan speed, the moveable laser manipulates the plurality of dislocations on the surface portion of the semiconductor body by adjusting the temperature and the scan speed of the laser beam.
