PROBLEM TO BE SOLVED: To provide an inexpensive imaging device having a simple configuration, capable of minimizing the imaging device, and reducing an occurrence risk of electric connection failure, and an endoscope using the imaging device.SOLUTION: An imaging device 1 according to the present invention includes: bonding wires 10 that electrically connect an imaging element 2 to a semiconductor element 3 first connecting sections that have a plurality of lands 2a provided on a surface 2A or a rear face 2B of the imaging element 2 to which one ends of the bonding wires 10 are connected, and a plurality of lands 3a that are provided eccentrically to at least one first lateral face 3C1 of a surface 3A or a rear face 3B of the semiconductor element 3 to which the other ends are connected and flexible board connection lands 3b as a plurality of second connecting sections which a flexible board 5 is connected to and are provided eccentrically to a second lateral face 3C2 of a lateral face different from the first lateral face 3C1 of the surface 3A or the rear face 3B of the semiconductor element 3.COPYRIGHT: (C)2014,JPO&INPIT【課題】簡単な構成で、撮像装置の小型化を図ることができるとともに、電気的接続不良の発生のリスクを軽減することができる安価な撮像装置及びこの撮像装置を用いた内視鏡を提供する。【解決手段】本発明に係る撮像装置1は、撮像素子2と半導体素子3とを電気的に接続するボンディングワイヤ10と、ボンディングワイヤ10の一端が接続される撮像素子2の表面2Aまたは裏2B面に設けられた複数のランド2aと、他端が接続される半導体素子3の表面3Aまたは裏面3Bの少なくとも1つの第1の側面3C1寄りに偏り設けられた複数のランド3aと、を有する第1の接続部と、半導体素子3の表面3Aまたは裏面3Bの、前記第1の側面3C1とは異なる側面の第2の側面3C2寄りに偏り設けられ、フレキシブル基板5が接続される複数の第2の接続部であるフレキシブル基板接続用ランド3bと、を有する。【選択図】図1
