Ameara S. Mansour,Kevin P. Davis,David B. Malcolm,Mark S. Kroll,Steven R. Vaughan,Timothy W. Roska,Evan Yuan
申请号：
US15071959
公开号：
US10414957B2
申请日:
2016.03.16
申请国别(地区):
US
年份:
2019
代理人:
摘要：
This invention claims low application temperature hot melt adhesive compositions including at least about 15% by weight of a first styrene block copolymer with a melt flow rate of at least about 15 g/10 minutes (190° C., 2.16 kgs) and a diblock content of no greater than about 10% by weight.
