An implantation pin (1) for implantation in a target structure is provided with a pinhead (3) and a shaft (5). The pinhead (3) comprises a pinhead moulding portion (7) comprising a mouldable material which can be liquefied by application of mechanical energy such as ultrasonic vibration energy. A channel (11) extends through the pinhead (3) and the shaft (5), the channel connecting the pinhead moulding portion to a discharge opening (13) located at the shaft. The mouldable material can be liquefied by applying mechanical energy e.g. in the form of ultrasonic vibrations via e.g. a fixation device including an ultrasonic sonotrode and a vibrating tip (45). The pressure applied by the vibrating tip (45) can be transmitted via the border of the pinhead (3) to the target structure while the liquefied mouldable material can be forced through the channel (11) and the discharge opening (13) into a gap between the implantation pin (1) and a recess in a target structure thereby fixing the implantation pin in the target structure.
