DEVICE FOR COOLING HEAT TRANSFER SOLID FOR PRECISELY CONTROLLING THE TEMPERATURE, SAID DEVICE OPTIONALLY BEING ASSOCIATED WITH AN ENDOTHERMIC OR EXOTHERMIC PROCESS
The present invention describes a device for controlling cooling of a heat transfer solid supplying or withdrawing heat to or from a unit carrying out globally endothermic or exothermic reactions respectively. The exchange bundle of said device is in a triangular pattern.