Robert Bennett;Milind Raje;Andrew Mudie;Gary Mark Ignacio
发明人:
Milind Raje,Robert Bennett,Andrew Mudie,Gary Mark Ignacio
申请号：
US13790141
公开号：
US09351436B2
申请日:
2013.03.08
申请国别(地区):
US
年份:
2016
代理人:
摘要：
Presented herein are stud bump bonding techniques for electrically connecting an elongate conductor, such as a wire or pin, to a bonding pad. A plurality of stud bumps are bonded to a surface of a bonding pad and an elongate electrical conductor is positioned in proximity to the plurality of stud bumps. The elongate conductor is bonded to one or more of the stud bumps.
