Techniques and tools for bonding components of an implantable medical device are disclosed. Such techniques may be implemented to bond components of a battery of the implantable medical device that may include a cover, a case, an electrode assembly and a feedthrough pin for forming one of the anode or cathode terminals. The implantable medical device includes a battery that is enclosed in a housing to supply power to other electrical components of the device and to generate stimulation pulses for functions such as therapy delivery and sensing by the device.
