PROBLEM TO BE SOLVED: To provide a thin-type ultrasonic transducer element chip having sufficient strength in a thickness direction of a substrate.SOLUTION: A plurality of openings 45 is disposed in an array on a substrate 21. The plurality of openings 45 are separated from one another by partition walls 51. An ultrasonic transducer element 23 is provided for each of the plurality of openings 45. A plate-like member 52 is fixed to a rear surface of the substrate 21. A thickness t of each of the partition walls 51 is smaller in comparison with a wall height H of each of the partition walls 51.COPYRIGHT: (C)2013,JPO&INPIT【課題】薄型で、かつ、基板の厚み方向に十分な強度を有する超音波トランスデューサー素子チップは提供される。【解決手段】基板21にはアレイ状に複数の開口45が配置される。開口45同士は仕切り壁51で相互に隔てられる。個々の開口45ごとに超音波トランスデューサー素子23が設けられる。基板21の裏面には板状部材52が固定される。仕切り壁51の壁厚みtは仕切り壁51の壁高さHに比べて小さい。【選択図】図4
