Provided are an imaging device, an endoscope system, and a manufacturing method of the imaging device that can be reduced in size and have excellent connection reliability. The imaging device 100 of the present invention includes an imaging device 10 having a light receiving portion 12a and a plurality of sensor electrodes 13, two substrates 21 and 23, an electronic component 28 mounted on the substrate 23, and an electronic component 28. A body electrode 22 sealed with a sealing resin, a substrate electrode 26 formed on the front surface, a cable electrode 24 formed on the back surface, and a plurality of pins 27 erected on the substrate 21. The core wire that has the relay substrate 20 to which the substrate electrode 26 is connected to the sensor electrode 13, the plurality of cables 31, and the cable fixing member 32 that fixes the cable 31, and is exposed on the connection surface of the cable fixing member 32. 34 is connected to the cable electrode 24, and the thermal expansion coefficient of the image pickup device 10, the thermal expansion coefficient of the relay board 20, and the thermal expansion coefficient of the aggregate cable 30 are sequentially smaller or larger. Characterized by comprising a Kaiteki change.
