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PACKAGING STRUCTURE FOR PATCHES
专利权人:
Kensuke Matsuoka
发明人:
Kensuke Matsuoka,Yoshihiro Iwao,Jun Harima,Masakatsu Konno,Kazuhiro Aoyagi,Tomoya Tanaka,Mikio Toyota,Yasuhiko Akita,Tadashi Matsui
申请号:
US14232358
公开号:
US20140158571A1
申请日:
2012.07.13
申请国别(地区):
US
年份:
2014
代理人:
摘要:
A packaging structure (100) for a patch includes a first and second base materials (120, 130) which have a peripheral edge part laminated with each other, and the patch is included therein. The first and second base materials (120, 130) have a first to forth sides (121 to 124, 131-134). At least one of the first and second base materials (120, 130) has a first to third opening parts (125 to 127, 135 to 137). The first to third opening parts (125 to 127, 135 to 137) guides so as to open toward the inner peripheral edge (120c1, 120c2, 120c4, 130c1, 130c2, 130c4) of the sealing part (120c, 130c).
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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