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PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM PREPARED THEREFROM
专利权人:
Rohm and Haas Electronic Materials Korea Ltd.
发明人:
Kim Yeonok,Huh Geun,Yang Jong Han,Kwon Jin,Im Jin Kyu
申请号:
US201715725388
公开号:
US2018095365(A1)
申请日:
2017.10.05
申请国别(地区):
美国
年份:
2018
代理人:
摘要:
The present invention relates to a photosensitive resin composition and to a cured film formed therefrom, wherein the photosensitive resin composition can improve the sensitivity by using an alcoholic solvent, along with a siloxane polymer and a quinone diazide compound conventionally used, which enhances the solubility in a developer through an interaction between the alcohol and the diazonaphthoquinone (DNQ) group in the quinone diazide compound, as well as can form a cure film having excellent film retention rate even after post-bake.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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