PROBLEM TO BE SOLVED: To provide an ultrasonic probe and a method for manufacturing the ultrasonic probe capable of solving the shortage of the pressurizing force and ensuring the connection by sufficiently ensuring the rigidity of a substrate in thermocompressive bonding.SOLUTION: The ultrasonic probe includes: a circuit board 30 having electronic components processing signal information obtained from a transducer and terminals formed on a front surface and a back surface a plurality of first flexible wire substrates 40 connected in such a manner that one end is connected to the transducer and the other end is connected to a terminal at a side of the front surface of the circuit board substrate with an ACF 100 interposed therebetween a plurality of second flexible wire substrates 50 connected in such a manner that one end is connected to the transducer and the other end is connected to a terminal at a side of the back surface of the circuit board substrate 30 with an ACF 100 interposed therebetween and a dummy materials 33 including substantially the same rigidity and thickness as those of the first flexible wire substrate is arranged at a space, adjacent to a terminal at the side of the front surface of the circuit board substrate 30, corresponding to the other end of the second flexible wire substrate.COPYRIGHT: (C)2013,JPO&INPIT【課題】熱圧着の際の基材の剛性を十分に確保することで、加圧力不足を解消し、接合を確実に行うこと。【解決手段】振動子から得られる信号情報を処理する電子部品と表面及び裏面に形成された端子とを有する回路基板30と、一端が振動子に、他端が回路基板の表面側の端子にACF100を介して接続された複数の第1のフレキシブル配線基板40と、一端が振動子に、他端が回路基板30の裏面側の端子にACF100を介して接続された複数の第2のフレキシブル配線基板50と、回路基板30の表面側の端子に隣接するとともに、第2のフレキシブル配線基板の他端に対応する部位に、第1のフレキシブル配線基板と同等の剛性及び厚さを有するダミー部材33が配置されている。【選択図】図4A
