PROBLEM TO BE SOLVED: To provide an ultrasonic probe capable of realizing high transmission/reception sensitivity over a wide frequency band. SOLUTION: A circuit board 23 having a concave portion on the lower surface side of a first area, and a buffer layer 400 formed of an insulating material and a buffer layer 400 on a second area of the circuit board 23 different from the first area. The first piezoelectric element 100 for ultrasonic wave transmission, which is formed on the first region of the circuit board 23 without intervention, and the ultrasonic wave receiving device, which is formed on the second region of the circuit board 23 via the buffer layer 400. An element array layer 22 having a second piezoelectric element 200, the first piezoelectric element 100 vibrates in a flexural vibration mode on the circuit board 23, and the second piezoelectric element 200 vibrates in thickness on the circuit board 23. An ultrasonic probe that vibrates in different modes. [Selection diagram] Fig. 5【課題】広い周波数帯域に亘って、高い送受信感度を実現し得る超音波プローブを提供すること。【解決手段】第１領域の下面側に凹部を有する回路基板２３と、回路基板２３の第１領域とは異なる第２領域上において、絶縁材料により形成されたバッファ層４００と、バッファ層４００を介さず回路基板２３の第１領域上に形成された超音波送信用の第１圧電素子１００、及び、バッファ層４００を介して回路基板２３の第２領域上に形成された超音波受信用の第２圧電素子２００を有する素子アレー層２２と、を備え、第１圧電素子１００は、回路基板２３上において撓み振動モードで振動し、第２圧電素子２００は、回路基板２３上において厚さ振動モードで振動する、超音波プローブ。【選択図】図５
