The present invention relates to a cutting apparatus including a device for the treatment of a beam l. a.s.e.r. generated by a femtosecond laser (1), and is disposed downstream from said femtosecond laser, the processing device comprising: a system for shaping (3) positioned on the trajectory of said beam, in order to modulate the phase of the wavefront of the beam l.a.s.e.r. according to a modulation pre-set calculated in order to distribute the energy of the beam l. a.s.e.r. at least two points of impact, forming a pattern in its focal plane, - an optical focusing system (5) downstream of the system of shaping, the optical focusing system comprising a hub for focusing the beam l. a.s.e.r. modulated in phase in a focusing plane and a positioning module in depth in order to displace the focusing plane of a plurality of cutting planes, - a scanner optical scanning (4) arranged between the hub and the positioning module in depth in order to displace the pattern in the plane of cut into a plurality of positions.
