Réseau d'électrodes pour un implant transmodiolaire et procédé de fabrication

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专利权人:

Oticon Medical A/S

发明人:

申请号：

EP14192294.8

公开号：

EP3017842A1

申请日:

2014.11.07

申请国别(地区):

EP

年份:

2016

代理人:

摘要：

According to an embodiment, an electrode array for a transmodiolar implant is disclosed. The implant includes a substrate, a conductive metal located at a plurality of discrete portions on the substrate； and a single layer of insulation material over the conductive metal and the substrate. The single layer of insulation material includes a plurality of apertures that expose the conductive metal, the exposed conductive metal forming the electrode array.

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中国工程科技知识中心

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http://www.ckcest.cn/home/